Semiconductor manufacturing / TSM

TSMC (TSM): AI Chips, CoWoS Packaging and Arizona Expansion

Financial evidence, stock performance and the questions that connect this company to the physical AI buildout.

Earnings and disclosures

Latest verified results: Q3 2026 · Released 2026-10-15

Next results: No next results date listed in the official event listings checked 2026-10-18.

Checked 2026-10-18 · Company investor disclosure · Financial context and sources ↓

Reviewed October 6, 2026NYSE · TSMYahoo Finance ↗

Business scale

$122.42B

Total annual company revenue · year ended 2025-12-31. Company-published USD translation. This is company-wide revenue.

Annual financial evidence ↗ · Compare the revenue ranking
Company announcement / 2026-07-16

Prior Q2 financial context

TSMC reported second-quarter 2026 revenue of US$40.20 billion, up 33.7% in US dollars. Advanced technologies of 7 nanometers and below represented 77% of wafer revenue. Technology mix does not identify the share of revenue earned from AI.

Read the primary announcement ↗

Selected dated update; this editorial snapshot does not refresh automatically.

What we can say about AI revenue

No comparable annual AI-only revenue figure is separately sourced for this company in our current edition. Company revenue, segment revenue, spending and order commitments should not be used as substitutes.

See the 100-company disclosure tracker →

Investor questions / editorial analysis

What to watch

Can advanced-node and packaging capacity meet customer demand while delivering attractive returns? Watch technology mix, capital intensity and customer demand. Advanced-node wafer revenue is not interchangeable with AI-only revenue.

These are research questions, not a valuation conclusion or a recommendation to buy or sell.

Connect the company to the buildout

Explore the project atlas for context on infrastructure demand. This page does not assign revenue or a verified contract to an individual project.

Financial results and infrastructure investment

The Q2 figures below are prior-period context. TSMC released its Q3 2026 results on October 15, superseding the earlier quarterly update; see the current earnings summary above. TSMC reported USD 40.20 billion revenue, 67.7% gross margin and 60.3% operating margin. September’s monthly sales disclosure is a separate monthly indicator, rather than the complete Q3 earnings report.

Management’s July guidance sets a companywide 2026 capital budget of USD 60–64 billion. This annual global budget is distinct from Arizona’s USD 265 billion multi-year investment plan. Overseas-fab gross-margin dilution guidance of 2–3 percentage points initially and 3–4 points later covers overseas facilities collectively, not Arizona alone.

The August 11 board approved about USD 29.44 billion of companywide capital appropriations. Authorizations are not cash spent and should not be added mechanically to annual capital guidance.

Our analysis: assess whether advanced-node and packaging demand converts into profitable output and cash generation. Companywide results do not establish Arizona revenue, utilization or standalone returns. Arizona campus milestones and funding conditions →

Official financial evidence

Financial review: October 12, 2026. Reported results, guidance and editorial analysis are distinguished above.

TSMC’s role in AI infrastructure

TSMC manufactures semiconductor designs for its customers. Its AI exposure should be assessed through process capability, packaging, customer demand and the capital required to deliver them. Company-wide revenue and advanced-node wafer revenue are not AI-only revenue, and a relationship with a chip designer does not establish a contract for every campus using that designer’s products.

Latest monthly revenue disclosure

The October 8, 2026 SEC-filed disclosure reports September revenue of NT$511.86 billion, up 54.6% year over year and down 0.6% from August. January–September revenue totals NT$3,898.73 billion, up 41.1%. These consolidated sales are not AI-only revenue or a complete quarterly earnings report.

TSMC September revenue filing → · Reviewed October 12, 2026.

Wafer fabrication versus CoWoS advanced packaging

TSMC’s 3DFabric technology portfolio includes CoWoS, InFO and SoIC for integrating chips into packaged systems. CoWoS means Chip on Wafer on Substrate. Packaging and wafer fabrication serve different steps in the manufacturing chain; a wafer fab announcement is not a packaging capacity measurement.

TSMC 3DFabric technology overview → · CoWoS technical description →

Our analysis: For AI accelerators, the economic question is whether silicon fabrication, packaging and customer system deployment can expand together. Capacity constraints at any step can delay revenue conversion; adding supply faster than durable demand can lower utilization. This review does not establish a current quantified CoWoS shortfall, customer allocation or packaging revenue forecast.

Arizona: one campus, multiple delivery stages

Our new Arizona profile separates the operating first fab from the next manufacturing and packaging phases. The government-reported July investment envelope is an expansion plan, not money already spent or a fully operating campus.

TSMC Arizona: manufacturing and packaging milestones → · Track the next delivery gate →

What investors should monitor · Our analysis

Geographic expansion can diversify supply while increasing cost and execution complexity. Taiwan manufacturing and packaging remain essential to the company’s global footprint; this Arizona addition does not replace a full Taiwan campus audit. No new standalone Taiwan project is asserted in this review.

Investor takeaway · Our analysis

TSMC provides a manufacturing connection to the AI buildout, but a useful investment assessment needs more than AI demand headlines. Follow the balance between qualified wafer output, packaging delivery, sustained customer demand and capital returns. Keep reported company sales, disclosed production milestones and forward-looking expansion plans separate.

Targeted company review October 12, 2026. Earlier annual and quarterly figures retain their stated periods. No site-specific earnings, valuation target or investment recommendation established.

Arizona: documented AI production and infrastructure gates

NVIDIA reports Blackwell wafer volume production in Phoenix. The expanded project profile now covers customer evidence, fab-by-fab status, CHIPS award boundaries, Amkor partnership, the October interposer agreement and adopted wastewater conditions.

Read the full TSMC Arizona campus profile →

Reviewed October 12, 2026. Own-facility packaging, partner production and current site earnings remain separate questions.

Documented project connections

Each connection below has a specific, cited role. A supplier, lender, customer or proposed acquirer has different economics from the project owner.